Communication cards are responsible for collecting data from peripheral cards in cryogenics crates and transmitting it through the WorldFIP network. More than 1,000 communication cards are installed, primarily within the Large Hadron Collider (LHC). These cards were designed approximately 20 years ago, utilizing non-reprogrammable FPGAs, which restricts the ability to modify or update their functionality. The cost to replace these cards with new designs exceeds 1 million CHF. Consequently, any operational issues must be addressed by adding supplementary electronics to the existing cards, as reprogramming the FPGAs is not feasible.

While cryogenic electronics are generally reliable, some non-critical issues have been observed. During the annual Year End Technical Stops (YETS) tests at CERN, approximately 20% of the communication cards fail to power on correctly. In such instances, manual interventions and local resets are required to restore functionality. Additionally, rare corruption errors have occurred in the past. A few years ago in order to address these, an FPGA based add-on PCB was designed and installed in fewer than 100 communication cards. Due to the high cost of this solution, it was implemented only in the most critical cards. The total cost of installing this add-on across all communication cards would exceed 100,000 CHF, rendering it an impractical solution for widespread deployment. A new add-on PCB was designed in December 2023, incorporating only transistors, capacitors, diodes, and resistors. This new design significantly reduces production costs, with a total expenditure of 23,000 CHF, if employed to all existing communication cards. Due to its low production cost and reliable design, this add-on PCB now provides a viable solution for installation across all communication cards.

During YETS 2023, prototype PCBs were integrated into 19 communication cards, with all units operating as expected. A large-scale production run, involving over 1,300 PCBs, is scheduled for the coming months. The installation of these PCBs across all communication cards will be carried out during the next planned technical stop. Comprehensive laboratory tests, including temperature tests, have been conducted to ensure the reliability and performance of the new design.